Eliyan News
Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era
SANTA CLARA, Calif. – August 24, 2023 – Eliyan Corporation, an innovator in the field of efficient chiplet interconnect, announced its support for and compatibility
Eliyan Applauds Release of OCP’s Latest Multi-die Open Interconnect Standard, BoW 2.0; Demonstrates Industry’s First Working Silicon Compliant with the Spec
SANTA CLARA, Calif. – August 16, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, announced its
Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era
Eliyan’s 40Gbps/bump chiplet interconnect silicon demonstrates the capability to achieve beachfront bandwidths up to 3Tbps/mm on standard organic substrate at unprecedented power, area, and latency, eliminating the need for complex Silicon Interposers in most applications.
Chiplet Pioneer Eliyan Names Noted Communications Circuit Expert and IEEE Pederson Award Winner Dr. Behzad Razavi as Chief Technologist
SANTA CLARA, Calif. – April 11, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today
Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced it has joined two key industry standardization
Eliyan Closes $40M Series A Funding Round and Unveils Industry’s Highest Performance Chiplet Interconnect Technologies
Tapeout of Chiplet Connectivity Technology in 5nm Process Confirms Major Bandwidth, Power, Latency Advantages for UCIe-Compliant Die-to-Die Connectivity Company’s chiplet packaging method is critical to
Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era
SANTA CLARA, Calif. – August 24, 2023 – Eliyan Corporation, an innovator in the field of efficient chiplet interconnect, announced its support for and compatibility
Eliyan Applauds Release of OCP’s Latest Multi-die Open Interconnect Standard, BoW 2.0; Demonstrates Industry’s First Working Silicon Compliant with the Spec
SANTA CLARA, Calif. – August 16, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, announced its
Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era
Eliyan’s 40Gbps/bump chiplet interconnect silicon demonstrates the capability to achieve beachfront bandwidths up to 3Tbps/mm on standard organic substrate at unprecedented power, area, and latency, eliminating the need for complex Silicon Interposers in most applications.
Chiplet Pioneer Eliyan Names Noted Communications Circuit Expert and IEEE Pederson Award Winner Dr. Behzad Razavi as Chief Technologist
SANTA CLARA, Calif. – April 11, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today
Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced it has joined two key industry standardization
Eliyan Closes $40M Series A Funding Round and Unveils Industry’s Highest Performance Chiplet Interconnect Technologies
Tapeout of Chiplet Connectivity Technology in 5nm Process Confirms Major Bandwidth, Power, Latency Advantages for UCIe-Compliant Die-to-Die Connectivity Company’s chiplet packaging method is critical to
Eliyan in the News
Chiplets in the News
Chip suppliers eyeing chiplet to meet growing demand for HPC
Chiplets helped save AMD. They might also help save Moore’s law and head off an energy crisis.
To make chips faster, designers used to make them bigger — which is getting harder. To make better chips, the industry is turning to “chiplets.”