Eliyan in the News
Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced it has joined two key industry standardization
Eliyan Closes $40M Series A Funding Round and Unveils Industry’s Highest Performance Chiplet Interconnect Technologies
Tapeout of Chiplet Connectivity Technology in 5nm Process Confirms Major Bandwidth, Power, Latency Advantages for UCIe-Compliant Die-to-Die Connectivity Company’s chiplet packaging method is critical to
Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced it has joined two key industry standardization
Eliyan Closes $40M Series A Funding Round and Unveils Industry’s Highest Performance Chiplet Interconnect Technologies
Tapeout of Chiplet Connectivity Technology in 5nm Process Confirms Major Bandwidth, Power, Latency Advantages for UCIe-Compliant Die-to-Die Connectivity Company’s chiplet packaging method is critical to
Chiplets in the News
Chiplets helped save AMD. They might also help save Moore’s law and head off an energy crisis.
To make chips faster, designers used to make them bigger — which is getting harder. To make better chips, the industry is turning to “chiplets.”