Eliyan News

Eliyan in the News

EE Times | Startup Aims to Improve Chiplet Packaging

December 23, 2022

As semiconductor VC funding dips, startups trip, crash, build for the next boom

December 10, 2022

Semiconductor Engineering | Startup finding, November 2022

December 7, 2022

The 10 Hottest Semiconductor Startup Companies Of 2022

December 9, 2022

Embedded | Eliyan eliminates silicon interposer to advance D2D chiplet connect

December 1, 2022

Semiconductor Engineering | Is UCIe Really Universal?

December 1, 2022

The Linley Group | Eliyan Doubles UCIe Bandwidth

December 1, 2022

Tech Insights | Eliyan doubles UCIe Bandwidth

November 29, 2022

Design & Reuse | Eliyan eliminates silicon interposer to advance D2D chiplet connect for HPC

November 25, 2022

Business Insider | Read the pitch deck the chiplet startup Eliyan used to raise $40 million from investors like Tracker, Intel, and Micron

November 15, 2022

IEEE Spectrum | Linking Chiplets Just Got a Lot Easier

November 10, 2022

Eliyan’s interconnect scheme lets cheaper options match the speed of advanced packaging

DigiTimes Asia | Chiplet interconnect startup Eliyan, backed by Intel and Micron, announced successful tape-out on TSMC’s 5nm node

November 10, 2022

Chiplets in the News