The Ultimate Chiplet Interconnect. Period.
Eliyan’s PHY technology, NuLink™, enables the creation of super large SiPs on Standard Packaging, thus improving AI performance 10X by eliminating The Memory Wall
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Power Efficiency
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AI Performance
"Eliyan’s chiplet interconnect technology will make multi-die approaches more attractive to chip suppliers whose designs must optimize on power and bandwidth vectors."
John Lorenz, Senior Analyst
at Yole Intelligence
at Yole Intelligence
Industry Events
Chiplet Summit
February 6-8, 2024