The Ultimate Chiplet Interconnect. Period.

Eliyan’s PHY technology, NuLink™, enables the creation of super large SiPs on Standard Packaging, thus improving AI performance 10X by eliminating The Memory Wall

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AI Performance
"Eliyan’s chiplet interconnect technology will make multi-die approaches more attractive to chip suppliers whose designs must optimize on power and bandwidth vectors."
John Lorenz, Senior Analyst
at Yole Intelligence