Press Releases
The AI economy is reshaping compute infrastructure, requiring unprecedented performance, efficiency, and scale from cloud to edge. Data centers are undergoing their biggest shift yet, moving from commodity servers to rack-level systems and large-scale clusters designed specifically for AI.
Interconnect pioneer showcases industry’s most high-performance, power efficient interconnect solutions; presents advances in scalable chiplet architectures for the GenAI era; and highlights key technical contributions to BoW 2.1 Santa Clara, Calif., October 14, 2025 — Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced its participation
Initial silicon for characterization on SF4X advanced manufacturing process expected in early 2025, providing more options for multi-die integration with HBM SANTA CLARA, Calif. – November 20, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape out of its NuLink PHY