The Ultimate Chiplet Interconnect.
In 2016, Eliyan Founder and CEO Ramin Farjadrad developed a breakthrough die-to-die interconnect architecture that reached new levels of high bandwidth and low latency at best-in-class area and power efficiency. Eliyan is further developing that technology as the NuLink™ die-to-die (D2D) PHY supporting industry standard (BoW and UCIe) and proprietary (SBD – simultaneous bidirectional) solutions.
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Bandwidth
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Power Efficiency
It can deliver 4x the bandwidth and 2x the power efficiency of alternatives in advanced packaging or standard packaging using a wide range of bump pitches from 40-130 microns. And NuLink has been extended to support high-speed chip-to-chip (C2C) connections with the new NuLink-X PHY technology.
