News & Events

Videos

Press Release

Eliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology

Initial silicon for characterization on SF4X advanced manufacturing process expected in early 2025, providing more options for multi-die integration with HBM SANTA CLARA, Calif. – November 20, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape

Read the article

Eliyan in the Press

Media Kit

Headshots

Bios

Logos

Photo

Background

Industry Events

EE Times; Future of Chiplets (DAC 2025), June 23-25

EE Times: Future of Chiplets (DAC 2025)

June 23-25, 2025
ChipCon, July 7-10

ChipCon

July 7-10, 2025