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Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging

Tape out confirms most efficient and flexible UCIe-, BoW-, and UMI™-compatible multi-die solution for standard or advanced packaging implementations SANTA CLARA, Calif. – February 5, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape out of

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