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Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips

Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million. The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix, Cleveland Avenue and Mesh Ventures, amongst others.

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