Eliyan News

Initial silicon for characterization on SF4X advanced manufacturing process expected in early 2025, providing more options for multi-die integration with HBM SANTA CLARA, Calif. – November 20, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape out of its NuLink PHY […]

Working silicon confirms most efficient and flexible multi-die solution for scaling performance and bandwidth in the Gen AI era SANTA CLARA, Calif. –October 9, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today revealed the successful delivery of first silicon for its NuLink™-2.0 PHY, manufactured […]

Strategic round puts Eliyan over $100M in investment raised to date, adds key support from venture arm of world’s leading foundry SANTA CLARA, Calif. – August 13, 2024 – Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced a strategic investment from VentureTech Alliance. The […]

Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million. The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix, Cleveland Avenue and Mesh Ventures, amongst others.

Tape out confirms most efficient and flexible UCIe-, BoW-, and UMI™-compatible multi-die solution for standard or advanced packaging implementations SANTA CLARA, Calif. – February 5, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape out of the industry’s highest performing PHY […]

SANTA CLARA, Calif. – November 28, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced that it has appointed Dr. Jason Taylor to its board of directors. Taylor is an accomplished technical executive who most recently worked at Facebook/Meta, where he served as Vice […]

SANTA CLARA, Calif. – August 24, 2023 – Eliyan Corporation, an innovator in the field of efficient chiplet interconnect, announced its support for and compatibility with the new UCIe™ (Universal Chiplet Interconnect Express™) 1.1 specification.  The company has been involved with the industry-wide initiative to develop a framework for a more open and interoperable chiplet […]

SANTA CLARA, Calif. – August 16, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, announced its support for and compatibility with BoW 2.0, the new latest specification for a die-to-die interconnect standard from the Open Compute Project (OCP).  Eliyan’s team has deep roots in driving standards-based technologies […]

Eliyan’s 40Gbps/bump chiplet interconnect silicon demonstrates the capability to achieve beachfront bandwidths up to 3Tbps/mm on standard organic substrate at unprecedented power, area, and latency, eliminating the need for complex Silicon Interposers in most applications.