Eliyan News - Eliyan

Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips

March 25, 2024

Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million. The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix, Cleveland Avenue and Mesh Ventures, amongst others.

Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging

February 5, 2024

Tape out confirms most efficient and flexible UCIe-, BoW-, and UMI™-compatible multi-die solution for standard or advanced packaging implementations SANTA CLARA, Calif. – February 5, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape out of the industry’s highest performing PHY […]

Eliyan Appoints former head of Facebook/Meta AI infrastructure Dr. Jason Taylor to Board of Directors

November 28, 2023

SANTA CLARA, Calif. – November 28, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced that it has appointed Dr. Jason Taylor to its board of directors. Taylor is an accomplished technical executive who most recently worked at Facebook/Meta, where he served as Vice […]

Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era

August 24, 2023

SANTA CLARA, Calif. – August 24, 2023 – Eliyan Corporation, an innovator in the field of efficient chiplet interconnect, announced its support for and compatibility with the new UCIe™ (Universal Chiplet Interconnect Express™) 1.1 specification. The company has been involved with the industry-wide initiative to develop a framework for a more open and interoperable chiplet […]

Eliyan Applauds Release of OCP’s Latest Multi-die Open Interconnect Standard, BoW 2.0; Demonstrates Industry’s First Working Silicon Compliant with the Spec

August 15, 2023

SANTA CLARA, Calif. – August 16, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, announced its support for and compatibility with BoW 2.0, the new latest specification for a die-to-die interconnect standard from the Open Compute Project (OCP). Eliyan’s team has deep roots in driving standards-based technologies […]

Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era

May 23, 2023

Eliyan’s 40Gbps/bump chiplet interconnect silicon demonstrates the capability to achieve beachfront bandwidths up to 3Tbps/mm on standard organic substrate at unprecedented power, area, and latency, eliminating the need for complex Silicon Interposers in most applications.

Chiplet Pioneer Eliyan Names Noted Communications Circuit Expert and IEEE Pederson Award Winner Dr. Behzad Razavi as Chief Technologist

April 11, 2023

SANTA CLARA, Calif. – April 11, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced that it has named Dr. Behzad Razavi as its Chief Technologist to help guide the development of its next generation inter-chiplet PHY technology. Razavi is an accomplished researcher, lecturer […]

Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution

January 24, 2023

Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced it has joined two key industry standardization efforts, bringing its expertise to enable more universal and cost-effective methods for implementing die-to-die interconnect in heterogenous single packaged systems.

Eliyan Closes $40M Series A Funding Round and Unveils Industry’s Highest Performance Chiplet Interconnect Technologies

November 8, 2022

Tapeout of Chiplet Connectivity Technology in 5nm Process Confirms Major Bandwidth, Power, Latency Advantages for UCIe-Compliant Die-to-Die Connectivity Company’s chiplet packaging method is critical to realizing the scale of performance and integration required in a broad range of compute-intensive applications for hyperscalers, data centers, cloud computing, AI, and graphics Series A funding round raises $40m […]