Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips

SANTA CLARA, Calif. – March 25, 2024 – Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million. The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix, Cleveland Avenue and Mesh Ventures, amongst others.

The additional investment follows the company’s $40 million Series A round in 2022. It will enable Eliyan to continue its focus on the most pressing challenges facing the design and manufacturing of advanced AI chips that use multi-die architectures in either advanced packaging or standard organic substrates. Its chiplet interconnect technology allows chip makers to achieve new levels of performance and power efficiency.

In addition to die-to-die interconnect in chiplet-based designs, the company addresses the growing challenge of memory capacity and bandwidth in AI chips with its innovative Universal Memory Interface (UMI™). The bi-directional interconnect method aims at the “memory wall” issue facing large, multi-die designs. UMI enables a very bandwidth-efficient connection to memory, in both standard organic substrates and advanced packaging. Given its highly efficient PHY beachfront area, UMI provides a significant increase in aggregate memory bandwidth per AI chip and major die area reduction needed for memory interfaces. Read more on UMI here.

Eliyan’s NuLink™ PHY recently taped out on TSMC’s 3nm process, targeting industry-leading performance of up to 64Gbs per link, at an unprecedented performance/power ratio.

“We are thrilled to co-lead Eliyan’s Series B round and partner with an exceptional team known for their unique expertise in interconnect and mixed signal technologies,” said Marco Chisari, Head of Samsung Semiconductor Innovation Center and Executive Vice President, Samsung Electronics. “Intensive workloads and cutting-edge applications, including Generative AI and automotive, are driving the demand for more sophisticated semiconductor design and the adoption of chiplet architecture.”

“At a time when the explosion of AI is driving increasing connectivity needs and the semiconductor industry is undergoing a seismic shift with the rise of multi-die implementation, Eliyan is poised to revolutionize chiplet connectivity technology by unleashing the ultimate performance of chiplet-based systems,” said Srini Ananth, Managing Director at Intel Capital. “Eliyan’s continued advancements in die-to-die interconnect architecture and its scalability in the AI era, truly marks a significant milestone in the larger chiplet revolution.”

“This investment reflects the confidence in our approach to integrating multi-chip architectures that address the critical challenges of high costs, low yield, power consumption, manufacturing complexity, and size limitations. Our NuLink technology has achieved commercial readiness with tape outs in the most advanced processes, and is optimized for delivering the necessary high bandwidth, low latency, and low power capabilities. We thank all of our investors for their support of our vision of enabling the ultimate chiplet systems for the new AI era,” said Ramin Farjadrad, co-founder and CEO of Eliyan.