Eliyan in the News

Forbes | Eliyan Technology May Rewrite How Chiplets Come Together

April 4, 2023

Semiconductor Engineering | Mini-Consortia Forming Around Chiplets

March 20, 2023

Semiconductor Engineering | Panel Tackles Chiplet Packaging Challenges

March 16, 2023

EE Times | Designing with Chiplets to Build The Dream Chip

February 10, 2023

EE Journal | Calling All Chiplets! Eliyan and the Ultimate Chiplet Interconnect

February 3, 2023

Design & Reuse | Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution

January 31, 2023

Crunchbase News | Chip Stocks Are Down, But Pockets Of Semiconductor Startup Funding Still Robust

January 27, 2023

EE Times | Chiplet Standardization Requires Innovative Approach

January 26, 2023

EE Times | Startup Aims to Improve Chiplet Packaging

December 23, 2022

As semiconductor VC funding dips, startups trip, crash, build for the next boom

December 10, 2022