Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced it has joined two key industry standardization efforts, bringing its expertise to enable more universal and cost-effective methods for implementing die-to-die interconnect in heterogenous single packaged systems.
Tapeout of Chiplet Connectivity Technology in 5nm Process Confirms Major Bandwidth, Power, Latency Advantages for UCIe-Compliant Die-to-Die Connectivity Company’s chiplet packaging method is critical to realizing the scale of performance and integration required in a broad range of compute-intensive applications for hyperscalers, data centers, cloud computing, AI, and graphics Series A funding round raises $40m […]