Press Releases

Eliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology

November 20, 2024

Initial silicon for characterization on SF4X advanced manufacturing process expected in early 2025, providing more options for multi-die integration with HBM SANTA CLARA, Calif. – November 20, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape out of its NuLink PHY

Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process

October 9, 2024

Working silicon confirms most efficient and flexible multi-die solution for scaling performance and bandwidth in the Gen AI era SANTA CLARA, Calif. –October 9, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today revealed the successful delivery of first silicon for its NuLink™-2.0 PHY, manufactured

Chiplet interconnect pioneer Eliyan gains additional financial backing from AI chip ecosystem with strategic investment from VentureTech Alliance

August 12, 2024

Strategic round puts Eliyan over $100M in investment raised to date, adds key support from venture arm of world’s leading foundry SANTA CLARA, Calif. – August 13, 2024 – Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced a strategic investment from VentureTech Alliance. The