Press Releases

Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process

October 9, 2024

Working silicon confirms most efficient and flexible multi-die solution for scaling performance and bandwidth in the Gen AI era SANTA CLARA, Calif. –October 9, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today revealed the successful delivery of first silicon for its NuLink™-2.0 PHY, manufactured

Chiplet interconnect pioneer Eliyan gains additional financial backing from AI chip ecosystem with strategic investment from VentureTech Alliance

August 12, 2024

Strategic round puts Eliyan over $100M in investment raised to date, adds key support from venture arm of world’s leading foundry SANTA CLARA, Calif. – August 13, 2024 – Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced a strategic investment from VentureTech Alliance. The

Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips

March 25, 2024

Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million. The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix,