Press Releases

Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era

August 24, 2023

SANTA CLARA, Calif. – August 24, 2023 – Eliyan Corporation, an innovator in the field of efficient chiplet interconnect, announced its support for and compatibility with the new UCIe™ (Universal Chiplet Interconnect Express™) 1.1 specification. The company has been involved with the industry-wide initiative to develop a framework for a more open and interoperable chiplet

Eliyan Applauds Release of OCP’s Latest Multi-die Open Interconnect Standard, BoW 2.0; Demonstrates Industry’s First Working Silicon Compliant with the Spec

August 15, 2023

SANTA CLARA, Calif. – August 16, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, announced its support for and compatibility with BoW 2.0, the new latest specification for a die-to-die interconnect standard from the Open Compute Project (OCP). Eliyan’s team has deep roots in driving

Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era

May 23, 2023

Eliyan’s 40Gbps/bump chiplet interconnect silicon demonstrates the capability to achieve beachfront bandwidths up to 3Tbps/mm on standard organic substrate at unprecedented power, area, and latency, eliminating the need for complex Silicon Interposers in most applications.